View JMK316BJ106ML_3202169.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

??y features goy ordering code ;my applications 38 jmk316b j106ml _ t z 6 7 8 5 4 3 2 1 9 10 11 k0.45 v0.5 a0.8 d0.85 f 1.15 g 1.25 h1.5 l1.6 n1.9 y 2.0max m2.5 u3.2 q f y5v k 30 vj 85 c j 22 nk 82 l b j x7r k 55 vj 125 c m 15 l b j x5r k 55 vj 85 c m 15 l q c x5s k 55 vj 85 c m 22 l q c x6s k 55 vj 105 c m 22 l q ey5u k 30 vj 85 c m 22 nk 56 l k m 10 m m 20 z y a4 j6.3 l10 e16 t25 g35 u50 k plated 1 rated voltage h vdc i 3 end termination 5 temperature characteristics code 7 capacitance tolerances h l i k standard products 9 b bulk t tape & reel 8 thickness h mm i 4 dimensions h case size i f mm g 10 11 packaging internal code 107 f 0603 g 1.6 p 0.8 212 f 0805 g 2.0 p 1.25 316 f 1206 g 3.2 p 1.6 325 f 1210 g 3.2 p 2.5 432 f 1812 g 4.5 p 3.2 m multilayer ceramic capacitors 2 series name special code q standard products qw blank space qw blank space 6 nominal capacitance h pf i example 473 47,000 105 1,000,000 j 80 k 20 k0.45 v0.5 a0.8 d0.85 f 1.15 g 1.25 h1.5 l1.6 n1.9 y 2.0max m2.5 u3.2 b o ? f >n? g t ???a?e?? 107 f 0603 g 1.6 p 0.8 212 f 0805 g 2.0 p 1.25 316 f 1206 g 3.2 p 1.6 325 f 1210 g 3.2 p 2.5 432 f 1812 g 4.5 p 3.2 k m 10 % m m 20 % z% a4 j6.3 l10 e16 t25 g35 u50 k y?? ? 1 ?y h vdc i 37 0??0) k a j x?7 9 a
4 y
go h eia i l p w f mm g 10 ptgg? 11 2 3??? q a j ? qw ?? z??? 8
a ?? h mm i 6 ? ?
i?0? h pf i ? 473 47,000 105 1,000,000 q f y q c m 20 q e 20 b j m 10 j 30 k 80 5 9s?
q hli qw ?? j 20 k 55 m
u
??? j 80 k 20 y ??t ni ??;`zz??? ?ty???`ok?\qt??zx? i ?z
qs?|1?
qtby?z???3????q?r c
\dcz ?m ?t
q??`?b y sa? ? f esr g u ?^xz??u )
qtby?om?b{?t?? ??s?|????r???t z`h ? y ?m?0????v? y ?m?ypk?su? ? y y
? ?z u?yu?x ?t
qtby?? sw??uk??b y the use of nickel(ni) as material for both the internal and external elec- trodes improves the solderability and heat resistance characteristics. this almost completely eliminates migration and raises the level of reliability significantly. y low equivalent series resistance(esr) provides excellent noise absorp- tion characteristics. y compared to tantalum or aluminum electrolytic capacitors these ceramic capacitors offer a number of excellent features, including: higher permissible ripple current values smaller case sizes relative to rated voltage improved reliability due to higher insulation resistance and break- down voltage. y general digital circuit y power supply bypass capacitors liquid crystal modules liquid crystal drive voltage lines ls i, i c, converters(both for input and output) y smoothing capacitors dc-dc converters (both for input and output) switching power supplies (secondary side) y ???s?
? ` y ?o???? t??; ???y???; ?o?yw?m lsi z ic z op ??; y ??? dc-dc ??? f ??z z?; g ??????o f 2 ; g g0?
u
??????? high value multilayer ceramic capacitors k 25 vj 85 c k 25 vj 85 c k 25 vj 85 c k 55 vj 125 c k 55 vj 85 c k 55 vj 105 c k 30 vj 85 c k 25 vj 85 c k 30 vj 85 c bj f b x7r x5r c x5s x6s e y5u f y5v temp.characteristics code operating temp. range k 55 vj 85 c c e operating temp. www.datasheet.co.kr datasheet pdf - http://www..net/
?
goy external dimensions capacitors 4 39 unit d mm f inch g type f eia g lw t e 0.45 m 0.05 k g mk107 1.6 m 0.10 0.8 m 0.10 f 0.018 m 0.002 g 0.50 m 0.05 v f 0.020 m 0.002 g 0.35 m 0.25 (0603) f 0.063 m 0.004 gf 0.031 m 0.004 g y 0.8 m 0.10 a f 0.014 m 0.010 g f 0.031 m 0.004 g 0.45 m 0.05 k f 0.018 m 0.002 g g mk212 2.0 m 0.10 *1 1.25 m 0.10 *1 0.85 m 0.10 d 0.5 m 0.25 f 0805 gf 0.079 m 0.004 gf 0.049 m 0.004 gf 0.033 m 0.004 gf 0.020 m 0.010 g 1.25 m 0.10 *1 g f 0.049 m 0.004 g 0.85 m 0.10 d f 0.033 m 0.004 g 1.15 m 0.10 f g mk316 3.2 m 0.15 1.6 m 0.15 f 0.045 m 0.004 g 0.5 0000 (1206) f 0.126 m 0.006 gf 0.063 m 0.006 g 1.25 m 0.10 g f 0.020 y y g f 0.049 m 0.004 g 1.6 m 0.20 l f 0.063 m 0.008 g 0.85 m 0.10 d f 0.033 m 0.004 g 1.15 m 0.10 f f 0.045 m 0.004 g g mk325 3.2 m 0.30 2.5 m 0.20 *2 1.5 m 0.10 h 0.6 m 0.3 (1210) f 0.126 m 0.012 gf 0.098 m 0.008 g f 0.059 m 0.004 gf 0.024 m 0.012 g 1.9 m 0.20 n f 0.075 m 0.008 g 1.9 j 0.1 k 0.2 y y 2.5 m 0.20 *2 m f 0.098 m 0.008 g 2.5 m 0.20 m g mk432 4.5 m 0.40 3.2 m 0.30 f 0.098 m 0.008 g 0.9 m 0.6 (1812) f 0.177 m 0.016 gf 0.126 m 0.012 g 3.2 m 0.30 u f 0.035 m 0.024 g f 0.125 m 0.012 g j 0.35 k 0.25 j 0.014 k 0.010 j 0.004 k 0.008 f 0.075 g 1.9 j 0.1 k 0.2 j 0.004 k 0.008 f 0.075 g ? ? 1. m 0.15mm ?)k? ? 2. m 0.3mm ?)k? note: ? 1. inclulding dimension tolerance m 0.15mm fm 0.006inch g . note: ? 2. inclulding dimension tolerance m 0.3mm fm 0.012inch g . ?t??3 ??y available capacitance range bj jis b c x5s x6s e y5u k 25 v 85 k 25 v 85 k 55 v 85 k 25 v 85 20 m 10 m 20 f m g 2.5%max.** 7.0%max.** eia jis eia eia jis eia x7r* k 55 v 125 25 20 25 20 25 25 m 15 m 20 m 22 m 22 m 10 f k g c e f jis f k 25 v 85 20 f z g 7.0%max.** eia y5v k 30 v 85 k 30 v 85 k 55 v 105 25 9s c? hci temperature range , j9s hci ref. temp.
i?0?!=p hli capacitance change 9s?
q?? temp. char.code
i?0??0) hli capacitance tolerance tan dhli dissipation factor 9s?
q temperature characteristics j 80 k 20 j?f applicable standard j 20 n k 55 j 22 n k 56 j 30 n k 80 j 22 n k 82 ?
u
???????y low profile multilayer ceramic capacitors cap a f 0.022 0.033 0.047 0.068 0.100 0.150 0.220 0.330 0.470 0.680 1.000 1.500 2.200 3.300 4.700 6.800 10.000 22.000 47.000 82.000 100.000 type tc vdc 3[digits] 223 333 473 683 104 154 224 334 474 684 105 155 225 335 475 685 106 226 476 826 107 107 10 k 6.3 k k b/x5r 4 v x5r 6.3 v b/x7r b/x5r x5r f/y5v f/y5v b/x5r b/x7r 325 316 212 b/x5r c/x5s e/y5u 432 f/y5v 6.3 k b/x7r 50 d d 25 d d 16 d d 10 d 16 d d d 25 d d 10 k k d d 6.3 k d 6.3 k d 10 d 10 d 50 d 6.3 d 10 d d 25 d 16 d d 10 d d d 6.3 d 10 d 6.3 d 25 d 16 d 10 d d d 6.3 d y 6.3 n 6.3 y cap a f 0.022 0.033 0.047 0.068 0.1 0.15 0.22 0.33 0.47 0.68 1 1.5 2.2 3.3 4.7 6.8 10 22 47 100 220 type tc vdc 3[digits] 223 333 473 683 104 154 224 334 474 684 105 155 225 335 475 685 106 226 476 107 227 b/x7r b/x5r x5r x5r 107 212 316 325 432 f/y5v c/x5s x5r b/x7r b/x5r f/y5v b/x7r b/x5r f/y5v b/x7r b/x5r f/y5v b/x5r c/x5s f/y5v 25 a 16 a a a a a 10 a 35 a a 50 a 25 a a a a a a a 16 a a a a a 10 a a a a a 6.3 a 6.3 a a 4 a 25 a 25 a 16 a a a a 10 a a 6.3 g g 6.3 g 6.3 g 6.3 l l 6.3 f l.f l 50 a 35 g 25 g 16 g g 10 g g 50 g g g g 35 g 25 g g 16 g g g g 10 g g g g e/y5u c/x6s 4 y 6.3 m 6.3 m 6.3 n m 6.3 m u 6.3 m 6.3 m 6.3 m x5r c/x5s 6.3 l 4 l 50 g g 16 g 10 g g 50 g g 50 f l l 35 l l 25 f f l l 16 f f l l l 10 l l l 10 l l 25 l l l 16 l l l 50 g 35 g l 25 l 25 l 16 l 10 f l 50 h 25 h n m 16 n 10 n 35 n 25 n m.n 16 n n m 10 m m 50 h 35 h 16 f n 10 n.f 25 m 16 m 10 m 50 m 25 m m 6.3 u 10 m ??aa part numbers ?
q
$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions ?3???? selection guide * * x5r w?0 b???auk??b{ ?ix??aa?? xi^m{ ** e $s??gl`om?b{ ?ix??aa ?? xi^m{ * * some of the parts are only applicable to x5r. please refer to part numbers table. ** the figure indicates typical value. please refer to part numbers table. p.40 p.44 p.78 p.80 p.86 p.10 etc www.datasheet.co.kr datasheet pdf - http://www..net/
40 ??aa (0603 case size) 50v 35v 25v 16v 10v 6.3v 4v 50v 25v 16v 10v 6.3v umk10 7 bj 1 0 4 g a* gmk10 7 bj 3 3 3 g a gmk10 7 bj 4 7 3 g a tmk1 0 7 bj 2 2 3 g a tmk1 0 7 bj 6 8 3 g a tmk1 0 7 bj 1 0 4 g a tmk1 0 7 bj 1 5 4 g a tmk1 0 7 bj 2 2 4 g a tmk1 0 7 bj 3 3 4 g a tmk1 0 7 bj 4 7 4 g a* tmk1 0 7 bj 1 0 5 g a* emk10 7 bj 3 3 3 g a emk10 7 bj 4 7 3 g a emk10 7 bj 6 8 3 g a emk10 7 bj 1 0 4 g a emk10 7 bj 1 5 4 g a emk10 7 bj 2 2 4 g a emk10 7 bj 4 7 4 g a emk10 7 bj 1 0 5 g a* emk10 7 bj 1 0 5 g a* lmk1 0 7 bj 1 0 5 g k* lmk1 0 7 bj 3 3 4 g a lmk1 0 7 bj 4 7 4 g a lmk1 0 7 bj 6 8 4 g a lmk1 0 7 bj 1 0 5 g a* lmk1 0 7 bj 2 2 5 g a* jmk107 bj225 g v* jmk107 bj474 g k jmk107 bj105 g k* jmk107 bj225 g a* jmk107 bj335 g a* jmk107 bj475ma* amk10 7 bj 1 0 6ma* amk10 7 bj 2 2 5 g v* umk10 7 c1 0 5 g a* umk10 7 f 1 0 4 z a tmk1 0 7 f 4 7 4 z a emk10 7 f 2 2 4 z a emk10 7 f 4 7 4 z a emk10 7 f 1 0 5 z a emk10 7 f 2 2 5 z a lmk1 0 7 f 1 0 5 z a lmk1 0 7 f 2 2 5 z a jmk107 f105zk 0.1 0.033 0.047 0.022 0.068 0.1 0.15 0.22 0.33 0.47 1 0.033 0.047 0.068 0.1 0.15 0.22 0.47 1 1 1 0.33 0.47 0.68 1 2.2 2.2 0.47 1 2.2 3.3 4.7 10 2.2 1 0.1 0.47 0.22 0.47 1 2.2 1 2.2 1 b/x5r b/x5r b/x5r b/x7r b/x5r b/x5r b/x5r b/x5r b/x5r b/x5r b/x5r b/x7r b/x7r b/x7r b/x7r b/x5r b/x5r b/x5r b/x7r f b/x5r b/x5r b/x5r b/x5r b/x5r b/x7r b/x5r x5r b/x5r b/x5r b/x5r x5r x5r x5r x5r c/x5s f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v 3.5 2.5 2.5 2.5 3.5 3.5 3.5 3.5 3.5 3.5 5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 5 5 10 3.5 3.5 5 5 10 10 5 10 10 10 10 10 10 10 7 7 7 7 16 16 16 16 16 r/w r r/w r r/w r r/w r 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.45 m 0.05 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.5 m 0.05 0.45 m 0.05 0.45 m 0.05 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.5 m 0.05 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.8 m 0.1 0.45 m 0.05 m 10 l m 20 l m 10 l m 20 l m 20 l j 80 l k 20 l ratedvoltage y ?yy temperature characteristics capacitance [ a f] capacitance tolerance yy? [mm]
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e thickness ordering code yy f 107type part numbers z;~?
u
??????? y general ~ low profile multilayer ceramic capacitors g please specify the capacitance tolerance code. * test voltage of loading at high temperature test is 1.5 time of the rated voltage. f internal code shall be r. ** test voltage of loading at high temperature test is 1.3 time of the rated voltage. w g tx
i?0??0)g?u???b{ * ?9 ?y?gw?g?yx?yw 1.5 f ? ?t r u ?v?b{ ** ?9 ?y?gw?g?yx?yw 1.3 www.datasheet.co.kr datasheet pdf - http://www..net/
41 capacitors 4 ??aa (0603 case size) j 80 l k 20 l 50v 35v 25v 16v 10v 6.3v 50v 16v 10v 6.3v umk21 2 b j 2 23 g d umk21 2 b j 3 33 g d umk21 2 b j 4 73 g g umk21 2 b j 6 83 g g umk21 2 b j 1 04 g g umk21 2 b j 1 54 g g umk21 2 b j 2 24 g g umk21 2 b j 4 74 g g* gmk21 2 b j 3 34 g g gmk21 2 b j 4 74 g g tmk2 1 2 b j 4 73 g d tmk2 1 2 b j 6 83 g d tmk2 1 2 b j 4 74 g d tmk2 1 2 b j 1 05 g d* tmk2 1 2 b j 1 05 g g* tmk2 1 2 bj 1 05 g g tmk2 1 2 b j 2 25 g g* emk2 1 2 b j 4 74 g d emk2 1 2 b j 6 84 g d emk2 1 2 b j 1 05 g d emk2 1 2 b j 1 55 g d emk2 1 2 b j 2 25 g d emk2 1 2 b j 6 84 g g emk2 1 2 b j 1 05 g g emk2 1 2 b j 2 25 g g emk2 1 2 b j 4 75 g g* emk2 1 2 b j 1 06 g g* lmk2 1 2 b j 2 24 g k lmk2 1 2 b j 1 05 g k lmk2 1 2 b j 1 05 g d lmk2 1 2 b j 2 25 g d* lmk2 1 2 b j 4 75 g d* lmk2 1 2 b j 1 06 g d* lmk2 1 2 b j 1 05 g g lmk2 1 2 b j 2 25 g g lmk2 1 2 b j 3 35 g g lmk2 1 2 b j 4 75 g g* lmk2 1 2 b j 1 06 g g* jmk2 12 bj 1 05 g k jmk2 12 bj 4 75 g k* jmk2 12 bj 4 75 g d* jmk2 12 bj 1 06 g d* jmk2 12 bj 4 75 g g jmk2 12 bj 1 06 g g* jmk2 1 2 b j 2 26mg* umk21 2 f2 24 z d umk21 2 f4 74 z g umk21 2 f1 05 z g emk2 1 2 f2 25 z g lmk2 1 2 f2 25 z d lmk2 1 2 f4 75 z g lmk2 1 2 f1 06 z g jmk2 12 f4 75 z d jmk2 12 f1 06 z g 0.022 0.033 0.047 0.068 0.1 0.15 0.22 0.47 0.33 0.47 0.047 0.068 0.47 1 1 1 2.2 0.47 0.68 1 1.5 2.2 0.68 1 2.2 4.7 10 0.22 1 1 2.2 4.7 10 1 2.2 3.3 4.7 10 1 4.7 4.7 10 4.7 10 22 0.22 0.47 1 2.2 2.2 4.7 10 4.7 10 b/x7r b/x7r b/x7r b/x7r b/x7r b/x7r b/x5r b/x5r b/x7r b/x5r b/x7r b/x7r b/x5r b/x5r b/x7r f b/x5r b/x5r b/x7r b/x7r b/x5r b/x5r b/x5r b/x7r b/x7r b/x5r b/x5r b/x5r b/x5r b/x5r b/x7r b/x5r b/x5r x5r b/x7r b/x7r b/x5r b/x5r b/x5r b/x5r x5r b/x5r x5r b/x5r b/x5r x5r f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v 2.5 2.5 2.5 2.5 2.5 3.5 3.5 3.5 3.5 3.5 2.5 2.5 3.5 5 5 5 5 3.5 3.5 5 5 5 3.5 3.5 5 5 10 3.5 5 3.5 5 10 10 3.5 5 5 5 10 5 10 10 10 5 10 10 7 7 7 7 9 9 16 16 16 r/w r r/w r r/w r r/w r r/w r 0.85 m 0.1 0.85 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.15 1.25 m 0.15 0.45 m 0.05 0.45 m 0.05 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.15 1.25 m 0.15 0.45 m 0.05 0.45 m 0.05 0.85 m 0.1 0.85 m 0.1 1.25 m 0.15 1.25 m 0.15 1.25 m 0.15 0.85 m 0.1 1.25 m 0.1 1.25 m 0.1 1.25 m 0.1 0.85 m 0.1 1.25 m 0.1 1.25 m 0.1 0.85 m 0.1 1.25 m 0.1 m 10 l m 20 l m 20 l ratedvoltage y ?yy temperature characteristics capacitance [ a f] capacitance tolerance yy? [mm]
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e thickness ordering code yy f 212type part numbers w g tx
i?0??0)g?u???b{ * ?9 ?y?gw?g?yx?yw 1.5 f ? ?t r u ?v?b{ ** ?9 ?y?gw?g?yx?yw 1.3 g please specify the capacitance tolerance code. * test voltage of loading at high temperature test is 1.5 time of the rated voltage. f internal code shall be r. www.datasheet.co.kr datasheet pdf - http://www..net/
42 part numbers ??aa (0603 case size) 50v 35v 25v 16v 10v 6.3v 4v 25v 50v 35v 25v 16v 10v 6.3v 0.15 0.22 0.47 0.68 1 0.15 0.22 0.33 0.68 1 2.2 3.3 4.7 10 1.5 2.2 0.68 1 2.2 3.3 4.7 4.7 10 3.3 4.7 10 3.3 4.7 10 10 22 6.8 10 10 10 22 22 47 47 10 2.2 4.7 10 10 10 4.7 10 22 10 b/x7r b/x7r b/x7r b/x7r b/x7r b/x7r b/x7r b/x7r b/x7r b/x5r b/x7r b/x5r b/x5r b/x5r b/x5r b/x5r b/x7r b/x7r b/x7r b/x7r b/x7r f b/x5r b/x5r b/x5r b/x5r b/x5r b/x7r b/x7r b/x7r f b/x5r b/x5r b/x5r b/x5r b/x5r b/x7r b/x7r f b/x5r x5r x5r c/x5s f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v 2.5 2.5 3.5 3.5 3.5 2.5 2.5 2.5 3.5 3.5 3.5 3.5 5 5 3.5 3.5 3.5 3.5 3.5 3.5 5 5 5 5 5 10 3.5 5 5 5 10 10 5 10 5 10 10 10 10 10 7 7 9 9 9 9 9 16 16 r/w r r/w r r/w r 1.15 m 0.1 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 0.85 m 0.1 1.15 m 0.1 1.15 m 0.1 1.6 m 0.2 0.85 m 0.1 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 0.85 m 0.1 0.85 m 0.1 1.15 m 0.1 1.15 m 0.1 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 0.85 m 0.1 0.85 m 0.1 0.85 m 0.1 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.15 m 0.1 1.15 m 0.1 0.85 m 0.1 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 1.25 m 0.1 1.25 m 0.1 1.6 m 0.2 1.6 m 0.2 1.6 m 0.2 0.85 m 0.1 1.15 m 0.1 1.6 m 0.2 0.85 m 0.1 m 10 l m 20 l m 10 l m 20 l m 20 l m 20 l j 80 l k 20 l ratedvoltage y ?yy temperature characteristics capacitance [ a f] capacitance tolerance yy? [mm]
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e thickness ordering code yy f 316type m 10 lm 20 l umk31 6 bj 1 5 4 g f umk31 6 bj 2 2 4 g l umk31 6 bj 4 7 4 g l gmk31 6 bj 6 8 4 g l gmk31 6 bj 1 0 5 g l tmk3 1 6 bj 1 5 4 g d tmk3 1 6 bj 2 2 4 g f tmk3 1 6 bj 3 3 4 g f tmk3 1 6 bj 6 8 4 g l tmk3 1 6 bj 1 0 5 g d tmk3 1 6 bj 2 2 5 g l tmk3 1 6 bj 3 3 5 g l tmk3 1 6 bj 4 7 5 g l* tmk3 1 6 bj 1 0 6 g l* emk31 6 bj 1 5 5 g d emk31 6 bj 2 2 5 g d emk31 6 bj 6 8 4 g f emk31 6 bj 1 0 5 g f emk31 6 bj 2 2 5 g l emk31 6 bj 3 3 5 g l emk31 6 bj 4 7 5 g l* emk31 6 bj 4 7 5 g l emk31 6 bj 1 0 6 g l* lmk3 1 6 bj 3 3 5 g d lmk3 1 6 bj 4 75 g d lmk3 1 6 bj 1 0 6 g d* lmk3 1 6 bj 3 3 5 g l lmk3 1 6 bj 4 7 5 g l lmk3 1 6 bj 1 0 6 g l* lmk3 1 6 bj 1 0 6 g l* lmk3 1 6 bj 2 2 6m l* jmk316 bj685 g f jmk316 bj106 g f jmk316 bj106 g d* jmk316 bj106 g l jmk316 bj226ml* jmk316 bj226ml* jmk316 bj476ml* amk31 6 bj 4 7 6m l* tmk3 1 6 c1 0 6 g l umk31 6 f 2 2 5 z g gmk31 6 f 4 7 5 z g gmk31 6 f 1 0 6 z l tmk3 1 6 f 1 0 6 z l emk31 6 f 1 0 6 z l lmk3 1 6 f 4 7 5 z d lmk3 1 6 f 1 0 6 z f lmk3 1 6 f 2 2 6 z l jmk316 f106zd g please specify the capacitance tolerance code. * test voltage of loading at high temperature test is 1.5 time of the rated voltage. f internal code shall be r. w g tx
i?0??0)g?u???b{ * ?9 ?y?gw?g?yx?yw 1.5 f ? ?t r u ?v?b{ ** ?9 ?y?gw?g?yx?yw 1.3 www.datasheet.co.kr datasheet pdf - http://www..net/
43 capacitors 4 part numbers ??aa (0603 case size) (0603 case size) j 80 l k 20 l 50v 35v 25v 16v 10v 6.3v 50v 35v 16v 10v 6.3v umk325 bj105 g h gmk325 bj 2 2 5mn tmk325 bj105md tmk325 bj225mh tmk325 bj335mn tmk325 bj475mn tmk325 bj106mn* tmk325 bj106mm* tmk325 bj106mm* emk325 bj475mn emk325 bj106md* emk325 bj106mn emk325 bj226mm* lmk325 bj335md lmk325 bj106mn lmk325 bj475md lmk325 bj106md* lmk325 bj226my* lmk325 bj226mm* lmk325 bj476mm* jmk325 bj685md jmk325 bj226my jmk325 bj826mn* jmk325 bj476mm* jmk325 bj107mm* jmk325 e826zn* jmk325 e107zm* umk325 f475zh gmk325 f 1 0 6 z h emk325 f226zn lmk325 f106zf lmk325 f226zn jmk325 f476zn jmk325 f107zm* 1 2.2 1 2.2 3.3 4.7 10 10 10 4.7 10 10 22 3.3 10 4.7 10 22 22 47 6.8 22 82 47 100 82 100 4.7 10 22 10 22 47 100 b/x7r b/x5r b/x7r b/x7r b/x7r b/x5r b/x5r b/x7r f b/x5r b/x7r b/x5r b/x5r b/x5r b/x5r b/x7r b/x5r b/x5r b/x5r b/x5r b/x5r b/x5r b/x5r x5r b/x5r x5r e/y5u e/y5u f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v f/y5v 3.5 3.5 3.5 3.5 3.5 3.5 5 5 5 3.5 5 3.5 5 3.5 3.5 5 5 5 5 10 5 5 10 10 10 16 16 7 7 16 16 16 16 16 r/w r 1.5 m 0.1 1.9 m 0.2 0.85 m 0.1 1.5 m 0.1 1.9 m 0.2 1.9 m 0.2 1.9 m 0.2 2.5 m 0.2 2.5 m 0.2 1.9 m 0.2 0.85 m 0.1 1.9 m 0.2 2.5 m 0.2 0.85 m 0.1 1.9 m 0.2 0.85 m 0.1 0.85 m 0.1 1.9 j 0.1 nk 0.2 2.5 m 0.2 2.5 m 0.2 0.85 m 0.1 1.9 j 0.1 nk 0.2 1.9 m 0.2 2.5 m 0.2 2.5 m 0.3 1.9 m 0.2 2.5 m 0.2 1.5 m 0.1 1.5 m 0.1 1.9 m 0.2 1.15 m 0.1 1.9 m 0.2 1.9 m 0.2 2.5 m 0.2 m 20 l ratedvoltage y ?yy temperature characteristics capacitance [ a f] capacitance tolerance yy? [mm]
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e thickness ordering code yy f 325type m 10 lm 20 l j 80 l k 20 l 25v 16v 10v 6.3v 50v 25v 6.3v 10v 6.3v tmk432 bj106mm emk432 bj226mm* lmk432 bj226mm jmk432 bj476mm* jmk432 bj107mu* umk432 c106mm* tmk432 c226mm* tmk432 c476mm* jmk432 c227mu* jmk432 c107mm* jmk432 c107my* lmk432 f476zm* jmk432 f107zm* 10 22 22 47 100 10 22 47 220 100 100 47 100 b/x5r b/x5r b/x5r b/x5r b/x5r c/x5s c/x5s c/x5s c/x5s c/x6s c/x5s f/y5v f/y5v 3.5 3.5 3.5 5 10 5 5 5 15 7 10 16 16 r 2.5 m 0.2 2.5 m 0.2 2.5 m 0.2 2.5 m 0.2 3.2 m 0.3 2.5 m 0.2 2.5 m 0.2 2.5 m 0.2 3.2 m 0.3 2.5 m 0.2 1.9 j 0.1 nk 0.2 2.5 m 0.2 2.5 m 0.2 m 20 l ratedvoltage y ?yy temperature characteristics capacitance [ a f] capacitance tolerance yy? [mm]
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e thickness ordering code yy f 432type g please specify the capacitance tolerance code. * test voltage of loading at high temperature test is 1.5 time of the rated voltage. f internal code shall be r. w g tx
i?0??0)g?u???b{ * ?9 ?y?gw?g?yx?yw 1.5 f ? ?t r u ?v?b{ ** ?9 ?y?gw?g?yx?yw 1.3 www.datasheet.co.kr datasheet pdf - http://www..net/
44 ?
q
$y electrical characteristics jmk107f225z ??e??? y esr *t
:?
q? example of impedance esr vs. frequency characteristics y pt
u
???????? (taiyo yuden multilayer ceramic capacitor) lmk107f105z lmk212f475z lmk316f226z jmk432f107z lmk432f476z lmk316f106z jmk325e107z www.datasheet.co.kr datasheet pdf - http://www..net/
45 capacitors 4 ?
q
$y electrical characteristics jmk212bj106m lmk432bj226m lmk212bj105k lmk212bj225m tmk107 c105m tmk316 c106m jmk432c107m www.datasheet.co.kr datasheet pdf - http://www..net/
78 v, w w a a z b d g d d d f g l d f h n m y 0.5 f 0.020 g 0.8 f 0.031 g 0.6 f 0.024 g 0.85 f 0.033 g 1.25 f 0.049 g 0.85 f 0.033 g 0.85 f 0.033 g 0.85 f 0.033 g 1.15 f 0.045 g 1.25 f 0.049 g 1.6 f 0.063 g 0.85 f 0.033 g 1.15 f 0.045 g 1.5 f 0.059 g 1.9 f 0.075 g 2.5 f 0.098 g 2.0max f 0.079 g g mk105 f 0402 g g vk105 f 0402 g g mk107 f 0603 g 0.8 f 0.031 g g 2k110 f 0504 g g mk212 f 0805 g g 4k212 f 0805 g g 2k212 f 0805 g g mk316 f 1206 g g mk325 f 1210 g a j
:? [ pcs ] f >n?a bulk packaging y 1000 mm f inch g code f a?e??ay taped packaging y a j
:? standard quantity [ pcs ]
a ?? thickness f eia g type p v, w w 0.3 f 0.012 g 0.5 f 0.020 g 0.5 f 0.020 g g mk063 f 0201 g g mk105 f 0402 g g vk105 f 0402 g mm f inch g code
a ?? thickness f eia g type e e 15000 10000 a j
:? standard quantity [ pcs ] a? paper ??a? embossed tape k a z b a k d g d d d f g l d f h n y m 0.45 f 0.018 g 0.8 f 0.031 g 0.8 f 0.031 g 0.6 f 0.024 g 0.45 f 0.018 g 0.85 f 0.033 g 1.25 f 0.049 g 0.85 f 0.033 g 0.85 f 0.033 g 0.85 f 0.033 g 1.15 f 0.045 g 1.25 f 0.049 g 1.6 f 0.063 g 0.85 f 0.033 g 1.15 f 0.045 g 1.5 f 0.059 g 1.9 f 0.075 g 2.0max f 0.079 g 2.5 f 0.098 g g mk107 f 0603 g g 2k110 f 0504 g g mk212 f 0805 g g 4k212 f 0805 g g 2k212 f 0805 g g mk316 f 1206 g g 4k316 f 1206 g g mk325 f 1210 g g mk432 f 1812 g e e e e e 3000 e e e 3000 2000 2000 2000 1000 500 500 4000 v e 4000 4000 4000 e 4000 4000 4000 e 4000 4000 4000 e e e e e e e 1.9 f 0.075 g 2.5 f 0.098 g 3.2 f 0.125 g y m u ay packaging 2 a?e??py taping material unit d mm f inch g 105, 107, 212 ypx0 ?`?bwpsemd<^m{ please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch) 3 ????y bulk cassette 1 7 ? !?o?
: minimum quantity www.datasheet.co.kr datasheet pdf - http://www..net/
capacitors 4 79 ay packaging 3 a?e??
goy taping dimensions y ya?y paper tape 8mm ? f 0.315inches wide g yyyyyyyyyyyyyyyyyyyy unit d mm f inch g unit d mm f inch g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abfkt 3.7 m 0.2 4.9 m 0.2 8.0 m 0.1 0.6max. g mk432 f 1812 g f 0.146 m 0.008 gf 0.193 m 0.008 gf 0.315 m 0.004 g 4.0max. f 0.024max. g f 0.157max. g y??a?y embossed tape 8mm ? f 0.315inches wide g unit d mm f inch g 4 ???? ?? ?y leader and blank portion y 160mm ? f 6.3inches or more g ?v z`m2 direction of tape feed 100mm ? f 3.94inches or more g 400mm ? f 15.7inches or more g 5 ???
goy reel size y 6 ??a?sy top tape strength y ??a?wxu`?x<
$1m2to 0.1 ? 0.7n qs??b{ the top tape requires a peel-off force of 0.1 v 0.7n in the direction of the arrow as illustrated below. ??a?y embossed tape 12mm ? f 0.472inches wide g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abfkt g mk212 f 0805 g 1.65 m 0.2 5 2.4 m 0.2 f 0.065 m 0.008 gf 0.094 m 0.008 g g mk316 f 1206 g 2.0 m 0.2 3.6 m 0.2 4.0 m 0.1 2.5max. 0.6max g 4k316 f 1206 g f 0.079 m 0.008 gf 0.142 m 0.008 gf 0.157 m 0.004 g f 0.098max. gf 0.024max. g g mk325 f 1210 g 2.8 m 0.2 3.6 m 0.2 3.4max. f 0.110 m 0.008 gf 0.142 m 0.008 g f 0.134max. g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abft g mk063 f 0201 g 0.37 m 0.06 5 0.67 m 0.06 55 2.0 m 0.05 0.45max. f 0.06 m 0.002 gf 0.027 m 0.002 gf 0.079 m 0.002 gf 0.018max. g g mk105 f 0402 g 0.65 m 0.1 5 1.15 m 0.1 55 2.0 m 0.05 0.8max. g vk105 f 0402 g f 0.026 m 0.004 gf 0.045 m 0.004 gf 0.079 m 0.002 gf 0.031max. g g mk107 f 0603 g 1.0 m 0.2 1.8 m 0.2 4.0 m 0.1 1.1max. f 0.039 m 0.008 gf 0.071 m 0.008 gf 0.157 m 0.004 gf 0.043max. g g 2k110 f 0504 g 1.15 m 0.2 1.55 m 0.2 4.0 m 0.1 1.0max. f 0.045 m 0.008 gf 0.061 m 0.008 gf 0.157 m 0.004 gf 0.039max. g g mk212 f 0805 g 1.65 m 0.2 5 2.4 m 0.2 g 4k212 f 0805 g f 0.065 m 0.008 gf 0.094 m 0.008 g 4.0 m 0.1 1.1max. g 2k212 f 0805 g f 0.157 m 0.004 gf 0.043max. g g mk316 f 1206 g 2.0 m 0.2 3.6 m 0.2 f 0.079 m 0.008 gf 0.142 m 0.008 g www.datasheet.co.kr datasheet pdf - http://www..net/
capacitors 4 81 b: m 10%, m 20% f d % b: 2.5% max. (50v, 25v) f: 5.0% max. (50v, 25v) y b d m 10 l fk 25 v 85 cg f d l fk 25 v 85 cg b f x7r g d m 15 l f f y5v g d yy l reliability data 1/3 item temperature compensating (class 1) standard specified value test methods and remarks high permitivity (class 2) high value standard note1 k 55 to j 125 c k 55 to j 125 c 50vdc,25vdc, 16vdc no breakdown or dam- age 10000 m e min. 0.5 to 5 pf: m 0.25 pf 1 to 10pf: m 0.5 pf 5 to 10 pf: m 1 pf 11 pf or over: m 5% m 10% 105typer q , s q , t q , u q only 0.5 ? 2pf : m 0.1pf 2.2 ? 20pf : m 5 % under 30 pf : q u 400 + 20c 30 pf or over : q u 1000 c= nominal capacitance ck d 0 m 250 cj d 0 m 120 ch d 0 m 60 cg d 0 m 30 pk d k 150 m 250 pj d k 150 m 120 ph d k 150 m 60 rk d k 220 m 250 rj d k 220 m 120 rh d k 220 m 60 sk d k 330 m 250 sj d k 330 m 120 sh d k 330 m 60 tk d k 470 m 250 tj d k 470 m 120 th d k 470 m 60 uk d k 750 m 250 uj d k 750 m 120 sl d +350 to -1000 (ppm/ c ) appearance: no abnormality capacitance change: within m 5% or m 0.5 pf, whichever is larger. b d k 55 to j 125 c f d k 25 to j 85 c b d k 55 to j 125 c f d k 25 to j 85 c 50vdc,25vdc k 25 to j 85 c k 25 to j 85 c 50vdc,35vdc,25vdc 16vdc,10vdc,6.3vdc 4dvc 16vdc 50vdc no abnormality no breakdown or damage 500 m ea f. or 10000 m e ., whichever is the smaller. note 5 0.5 to 2 pf : m 0.1 pf 2.2 to 5.1 pf : m 5% refer to detailed speci- fication ch d 0 m 60 rh d k 220 m 60 f ppm/ cg appearance: no abnormality capacitance change: within m 0.5 pf appearance: no abnormality capacitance change: b, bj, c: within m 12.5% e, f: within m 30% high frequency type 1.operating temperature range 2.storage temperature range 3.rated voltage 4.withstanding voltage between terminals 5.insulation resistance 6.capacitance (tolerance) 7. q or tangent of loss angle (tan d ) 8.temperature characteristic of capacitance 9.resistance to flexure of substrate (without voltage application) multilayer ceramic capacitor chips b d m 10 l z m 20 l c d m 10 l z m 20 l e d k 20 lnj 80 l f d k 20 lnj 80 l b d 2.5 l max. c z e z f d 7 l max. note 4 b d m 10 l y fk 25 vj 85 cg c d m 20 l y fk 25 vj 85 cg e d j 20 lnk 55 l y fk 25 vj 85 cg f d j 30 lnk 80 l y fk 25 vj 85 cg b f x7r z x5r g yy m 15 l c f x5s z x6s g yy m 22 l e f y5u g yy j 22 lnk 56 l f f y5v g yy j 22 lnk 82 l j 80 k 20 j 30 k 80 according to jis c 5102 clause 7.12. temperature compensating: measurement of capacitance at 20 c and 85 c shall be made to calculate temperature characteristic by the following equation. (c y - c y ) p 10 y (ppm/ c ) c y p q t y high permitivity: change of maximum capacitance deviation in step 1 to 5 temperature at step 1: +20 c temperature at step 2: minimum operating temperature temperature at step 3: +20 c (reference temperature) temperature at step 4: maximum operating temperature temperature at step 5: +20 c reference temperature for x7r, x5r, x5s, x6s, y5u and y5v shall be +25 c high capacitance type bj f x7r g d k 55 ? j 125 c ,bj f x5r g d k 55 ? j 85 c c f x5s g d k 55 ? j 85 c , c f x6s g d k 55 ? j 105 c e f y5u g d k 30 ? j 85 c , f f y5v g d k 30 ? j 85 c high capacitance type bj f x7r g d k 55 ? j 125 c ,bj f x5r g d k 55 ? j 85 c c f x5s g d k 55 ? j 85 c , c f x6s g d k 55 ? j 105 c e f y5u g d k 30 ? j 85 c , f f y5v g d k 30 ? j 85 c j 22 k 82 20 85 20 6 warp: 1mm testing board: glass epoxy-resin substrate thickness: 1.6mm (063 type : 0.8mm) the measurement shall be made with board in the bent position. applied voltage: rated voltage p 3 (class 1) rated voltage p 2.5 (class 2) duration: 1 to 5 sec. charge/discharge current: 50ma max. (class 1,2) applied voltage: rated voltage duration: 60 m 5 sec. charge/discharge current: 50ma max. measuring frequency d class1 d 1 " hz m 10% f c t 1000pf g 1 : hz m 10% f c x 1000pf g class2 d 1 : hz m 10% f c t 22 a f g 120hz m 10hz f c x 22 a f g measuring voltage d class1 d 0.5 v 5vrms f c t 1000pf g 1 m 0.2vrms f c x 1000pf g class2 d 1 m 0.2vrms f c t 22 a f g 0.5 m 0.1vrms f c x 22 a f g bias application: none multilayer: measuring frequency d class1 d 1 " hz m 10% f c t 1000pf g 1 : hz m 10% f c x 1000pf g class2 d 1 : hz m 10% f c t 22 a f g 120hz m 10hz f c x 22 a f g measuring voltage d yyyyyy class1 d 0.5 v 5vrms f c t 1000pf g 1 m 0.2vrms f c x 1000pf g class2 d 1 m 0.2vrms f c t 22 a f g 0.5 m 0.1vrms f c x 22 a f g bias application: none high-frequency-multilayer: measuring frequency: 1ghz measuring equipment: hp4291a measuring jig: hp16192a www.datasheet.co.kr datasheet pdf - http://www..net/
capacitors 4 83 reliability data 2/3 10.body strength 11.adhesion of electrode 12.solderability 13.resistance to soldering 14.thermal shock 15.damp heat (steady state) no mechanical dam- age. appearance: no abnor- mality capacitance change: within m 2.5% q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 0.25pf q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 0.5pf, insulation resistance: 1000 m e min. appearance: no abnormality capacitance change: within m 7.5% (b, bj) within m 15% (c) within m 20% (e, f) tan d : initial value note 4 insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnormality capacitance change: within m 7.5% (b, bj) within m 15% (c) within m 20% (e , f) tan d : initial value note 4 insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 2.5% or m 0.25pf, whichever is larger. q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 2.5% or m 0.25pf, whichever is larger. q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 5% or m 0.5pf, whichever is larger. q: c u 30 pf : q u 350 10 t c ? 30 pf: q u 275 + 2.5c c ? 10 pf : q u 200 + 10c c: nominal capacitance insulation resistance: 1000 m e min. no separation or indication of separation of electrode. at least 95% of terminal electrode is covered by new solder. appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : b: 5.0% max. f: 7.5% max. note 4 insulation resistance: 50 m ea f or 1000 m e whichever is smaller. note 5 appearance: no abnor- mality capacitance change: bj:within m 12.5% c(x6s) within m 25% c(x5s),e,f within m 30% note 4 tan d : bj: 5.0% max. c, e, f: 11.0% max. insulation resistance: 50 m ea f or 1000 m e whichever is smaller. note 5 high frequency multilayer: applied force: 5n duration: 10 sec. applied force: 5n duration: 30 m 5 sec. solder temperature: 230 m 5 c duration: 4 m 1 sec. preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) solder temperature: 270 m 5 c duration: 3 m 0.5 sec. preheating conditions: 80 to 100 c , 2 to 5 min. or 5 to 10 min. 150 to 200 c , 2 to 5 min. or 5 to 10 min. recovery: recovery for the following period under the stan- dard condition after the test. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) conditions for 1 cycle: step 1: minimum operating temperature c 30 m 3 min. step 2: room temperature 2 to 3 min. step 3: maximum operating temperature c 30 m 3 min. step 4: room temperature 2 to 3 min. number of cycles: 5 times recovery after the test: 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) item temperature compensating (class 1) standard test methods and remarks high permittivity (class 2) high value standard note1 high frequency type specified value multilayer d preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) temperature: 40 m 2 c humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 60 m 2 c humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. 24 m 2 hrs (class 1) multilayer ceramic capacitor chips +24 k 0 +24 k 0 j 0 k 3 k 0 j 3 0201 type 2n www.datasheet.co.kr datasheet pdf - http://www..net/
capacitors 4 85 reliability data 3/3 according to jis c 5102 clause 9. 9. multilayer: preconditioning: voltage treatment (class 2) temperature: 40 m 2 c humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage charge and discharge current: 50ma max. (class 1,2) recovery: recovery for the following period under the standard condition after the removal from test chamber. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 60 m 2 c humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage charge and discharge current: 50ma max. recovery: 24 m 2 hrs of recovery under the standard condi- tion after the removal from test chamber. according to jis c 5102 clause 9.10. multilayer: preconditioning: voltage treatment (class 2) temperature:125 m 3 cf class 1, class 2: b, bj f x7r gg 85 m 2 c (class 2: bj,f) duration: 1000 hrs applied voltage: rated voltage p 2 note 6 recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. as for ni product, thermal treatment shall be performed prior to the recovery. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 125 m 3 c (class 1) duration: 1000 hrs applied voltage: rated voltage p 2 recovery: 24 m 2 hrs of recovery under the standard condi- tion after the removal from test chamber. 16.loading under damp heat 17.loading at high tempera- ture appearance: no abnor- mality capacitance change: c t 2 pf: within m 0.4 pf c x 2 pf: within m 0.75 pf c d nominal capaci- tance insulation resistance: 500 m e min. appearance: no abnor- mality capacitance change: within m 3% or m 0.3pf, whichever is larger. insulation resistance: 1000 m e min. appearance: no abnor- mality capacitance change: within m 7.5% or m 0.75pf, whichever is larger. q: c u 30 pf: q u 200 c ? 30 pf: q u 100 + 10c/3 c d nominal capaci- tance insulation resistance: 500 m e min. appearance: no abnor- mality capacitance change: within m 3% or m 0.3pf, whichever is larger. q: c u 30 pf : q u 350 10 t c ? 30 pf: q u 275 + 2.5c c ? 10 pf: q u 200 + 10c c d nominal capacitance insulation resistance: 1000 m e min. appearance: no abnor- mality capacitance change: bj d within m 12.5 l c z e z f d within m 30 l note 4 tan d d bj d 5.0 l max. c z e z f d 11 l max. insulation resistance: 25 m ea f or 500 m e , whichever is the smaller. note 5 appearance: no abnormality capacitance change: bj d within m 12.5 l within m 20 l ff within m 25 l ff c d within m 25 l (x6s) within m 30 l (x5s) e z f d within m 30 l note 4 tan d d bj d 5.0 l max. c z f z f d 11 l max. insulation resistance: 50 m ea f or 1000 m e , whichever is smaller. note 5 appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : b: 5.0% max. f: 7.5% max. note 4 insulation resistance: 25 m ea f or 500 m e , whichever is the smaller. note 5 appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% note 4 tan d : b: 4.0% max. f: 7.5% max. insulation resistance: 50 m ea f or 1000 m e , whichever is smaller. note 5 item temperature compensating (class 1) standard specified value test methods and remarks high permittivity (class 2) high value standard note1 high frequency type +24 k 0 +24 k 0 +48 k 0 +48 k 0 multilayer ceramic capacitor chips note 1 :for 105 type, specified in "high value". note 2 :thermal treatment (multilayer): 1 hr of thermal treatment at 150 j 0 / k 10 c followed by 48 m 4 hrs of recovery under the standard condition shall be performed before the measurement. note 3 : voltage treatment (multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 4 8 m 4 hrs of recovery under the standard condition shall be performed before the measurement. note 4, 5 :the figure indicates typical inspection. please refer to individual specifications. note 6 :some of the parts are applicable in rated voltage p 1.5. please refer to individual specifications. note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 c of temperature, 45 to 85% relative humidity, and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted unde r condition of 20 m 2 c of temperature, 60 to 70% relative humidity, and 86 to 106kpa of air pressure. unless otherwise specified, all the tests are conducted under the "standard condition." www.datasheet.co.kr datasheet pdf - http://www..net/
precautions capacitors 4 87 1/6 technical considerations stages precautions precautions on the use of multilayer ceramic capacitors 1.circuit design verification of operating environment, electrical rating and per- formance 1. a malfunction in medical equipment, spacecraft, nuclear re- actors, etc. may cause serious harm to human life or have severe social ramifications. as such, any capacitors to be used in such equipment may require higher safety and/or reli- ability considerations and should be clearly differentiated from components used in general purpose applications. operating voltage (verification of rated voltage) 1. the operating voltage for capacitors must always be lower than their rated values. if an ac voltage is loaded on a dc voltage, the sum of the two peak voltages should be lower than the rated value of the ca- pacitor chosen. for a circuit where both an ac and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2. even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high fre- quency ac voltage or a pulse voltage having rapid rise time is present in the circuit. 1.the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amourts. f larger fillets which extend above the component end terminations g examples of improper pattern designs are also shown. (1) recommended land dimensions for a typical chip capacitor land patterns for pcbs 2.pcb design pattern configurations (design of land-patterns) 1. when capacitors are mounted on a pcb, the amount of sol- der used (size of fillet) can directly affect capacitor performance. therefore, the following items must be carefully considered in the design of solder land patterns: (1) the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to break- ing or cracking. therefore, when designing land-patterns it is necessary to consider the appropriate size and con- figuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) when more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-re- sist. recommended land dimensions for wave-soldering (unit: mm) recommended land dimensions for reflow-soldering (unit: mm) type 107 212 316 325 1.6 2.0 3.2 3.2 0.8 5 1.25 1.6 2.5 a0.8 v 1.0 1.0 v 1.4 1.8 v 2.5 1.8 v 2.5 b0.5 v 0.8 0.8 v 1.5 0.8 v 1.7 0.8 v 1.7 c0.6 v 0.8 0.9 v 1.2 1.2 v 1.6 1.8 v 2.5 l w size excess solder can affect the ability of chips to withstand mechanical stresses. therefore, please take proper precautions when designing land-patterns. size l w type 063 105 107 212 316 325 432 0.6 1.0 1.6 2.0 3.2 3.2 4.5 0.3 0.5 0.8 5 1.25 1.6 2.5 3.2 a 0.20 v 0.30 0.45 v 0.55 0.6 v 0.8 0.8 v 1.2 1.8 v 2.5 1.8 v 2.5 2.5 v 3.5 b 0.20 v 0.30 0.40 v 0.50 0.6 v 0.8 0.8 v 1.2 1.0 v 1.5 1.0 v 1.5 1.5 v 1.8 c 0.25 v 0.40 0.45 v 0.55 0.6 v 0.8 0.9 v 1.6 1.2 v 2.0 1.8 v 3.2 2.3 v 3.5 size type 316 4 circuits 212 4 circuits 3.2 2.0 1.6 1.25 a0.7 v 0.9 0.5 v 0.6 b1 0.5 v 0.6 c0.4 v 0.5 0.2 v 0.3 d0.8 0.5 l w size type 212 2 circuits 110 2 circuits 2.0 1.37 1.25 1.0 a0.5 v 0.6 0.35 v 0.45 b0.5 v 0.6 0.55 v 0.65 c0.5 v 0.6 0.3 v 0.4 d 1.0 0.64 l w www.datasheet.co.kr datasheet pdf - http://www..net/
precautions capacitors 4 89 2/6 (2) examples of good and bad solder application 2.pcb design 1-1. the following are examples of good and bad capacitor layout; smd capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. not recommended recommended deflection of the board pattern configurations (capacitor layout on panelized [breakaway] pc boards) 1. after capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufac- turing processes (pcb cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.) for this reason, planning pattern configurations and the position of smd capacitors should be carefully performed to minimize stress. items component placement close to the chassis not recommended recommended 1-2. to layout the capacitors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. the example below shows recommendations for better design. 1-3. when breaking pc boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. thus, any ideal smd capacitor layout must also consider the pcb splitting procedure. technical considerations stages precautions mixed mounting of smd and leaded components hand-soldering of leaded components near mounted components horizontal component placement precautions on the use of multilayer ceramic capacitors www.datasheet.co.kr datasheet pdf - http://www..net/
precautions capacitors 4 91 3/6 3.considerations for auto- matic placement adjustment of mounting machine 1. excessive impact load should not be imposed on the capaci- tors when mounting onto the pc boards. 2. the maintenance and inspection of the mounters should be conducted periodically. technical considerations stages precautions 1. if the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. to avoid this, the following points should be considered before lowering the pick-up nozzle: (1)the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for deflection of the board. (2)the pick-up pressure should be adjusted between 1 and 3 n static loads. (3)to reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the pc board. the following dia- grams show some typical examples of good pick-up nozzle placement: not recommended recommended single-sided mounting double-sided mounting 2. as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the capacitors because of mechanical impact on the capacitors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. 1. some adhesives may cause reduced insulation resistance. the difference between the shrinkage percentage of the adhesive and that of the capacitors may result in stresses on the capacitors and lead to cracking. moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. (1)required adhesive characteristics a. the adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. the adhesive should have sufficient strength at high temperatures. c. the adhesive should have good coating and thickness consistency. d. the adhesive should be used during its prescribed shelf life. e. the adhesive should harden rapidly f. the adhesive must not be contaminated. g. the adhesive should have excellent insulation characteristics. h. the adhesive should not be toxic and have no emission of toxic gasses. (2)the recommended amount of adhesives is as follows; figure 212/316 case sizes as examples a 0.3mm min b 100 v 120 a m c adhesives should not contact the pad selection of adhesives 1. mounting capacitors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded capacitor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. there- fore, it is imperative to consult the manufacturer of the adhe- sives on proper usage and amounts of adhesive to use. precautions on the use of multilayer ceramic capacitors www.datasheet.co.kr datasheet pdf - http://www..net/
precautions capacitors 4 93 4/6 4. soldering selection of flux 1. since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; (1)flux used should be with less than or equal to 0.1 wt% (equivelent to chroline) of halogenated content. flux hav- ing a strong acidity content should not be applied. (2)when soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level. (3)when using water-soluble flux, special care should be taken to properly clean the boards. soldering temperature, time, amount of solder, etc. are specified in accor- dance with the following recommended conditions. and please contact us about peak temperature when you use lead-free paste. 1-1. when too much halogenated substance (chlorine, etc.) content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 1-2. flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. to mini- mize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degrada- tion of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. 1-1. preheating when soldering heating: ceramic chip components should be preheated to within 100 to 130 c of the sol- dering. cooling: the temperature difference between the components and cleaning process should not be greater than 100 c . ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen- trated heating or rapid cooling. therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. technical considerations stages precautions precautions on the use of multilayer ceramic capacitors recommended conditions for soldering [reflow soldering] temperature profile 2. because excessive dwell times can detrimentally affect solderability, soldering dura- tion should be kept as close to recommended times as possible. [wave soldering] temperature profile caution 1. the ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thick- ness of the capacitor, as shown below: capacitor pc board solder caution 1. make sure the capacitors are preheated sufficiently. 2. the temperature difference between the capacitor and melted solder should not be greater than 100 to 130 c 3. cooling after soldering should be as gradual as possible. 4. wave soldering must not be applied to the capacitors designated as for reflow solder- ing only. peak 260 c max 10 sec max t ceramic chip components should be preheated to within 100 to 130 c of the soldering. t assured to be reflow soldering for 2 times. temperature fcg 300 200 100 0 preheating 150 c 60 sec min gradually cooling heating above 230 c 40 sec max peak 260 c max 10 sec max t ceramic chip components should be preheated to within 100 to 130 c of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. temperature fcg 300 200 100 0 gradually cooling preheating 150 c 120 sec min www.datasheet.co.kr datasheet pdf - http://www..net/
precautions capacitors 4 95 5/6 [hand soldering] y temperature profile 5.cleaning cleaning conditions 1. when cleaning the pc board after the capacitors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning (e.g. to remove soldering flux or other materials from the production process.) 2. cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the capacitor's characteristics. 1. the use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degra- dation of the capacitor's electrical properties (especially insulation resistance). 2. inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the capacitors. (1)excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; ultrasonic output below 20 w/ b ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less 4. soldering 6.post cleaning processes 1. with some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the harden- ing period or while left under normal storage conditions result- ing in the deterioration of the capacitor's performance. 2. when a resin's hardening temperature is higher than the capacitor's operating temperature, the stresses generated by the excess heat may lead to capacitor damage or destruction. the use of such resins, molding materials etc. is not recom- mended. breakaway pc boards (splitting along perforations) 1. when splitting the pc board after mounting capacitors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. board separation should not be done manually, but by using the appropriate devices. mechanical considerations 1. be careful not to subject the capacitors to excessive mechani- cal shocks. (1)if ceramic capacitors are dropped onto the floor or a hard surface, they should not be used. (2)when handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 7.handling technical considerations stages precautions precautions on the use of multilayer ceramic capacitors caution 1. use a 20w soldering iron with a maximum tip diameter of 1.0 mm. 2. the soldering iron should not directly touch the capacitor. f t?) t 190 cf 3216type max g , ?) t 130 cf 3225 type min gg t it is recommended to use 20w soldering iron and the tip is 1 b or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature fcg 400 300 200 100 0 gradually cooling 350 c max 3 sec max 60 sec min ?) www.datasheet.co.kr datasheet pdf - http://www..net/
precautions capacitors 4 97 6/6 8.storage conditions storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. hu- midity should especially be kept as low as possible. y recommended conditions ambient temperature below 40 c humidity below 70% rh the ambient temperature must be kept below 30 c . even un- der ideal storage conditions capacitor electrode solderability decreases as time passes, so should be used within 6 months from the time of delivery. y ceramic chip capacitors should be kept where no chlorine or sulfur exists in the air. 2. the capacitance value of high dielectric constant capacitors (type 2 &3) will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design. if such a capacitance reduction occurs, a heat treatment of 150 c for 1hour will return the capacitance to its initial level. 1. if the parts are stored in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solderability before using the capacitors. technical considerations stages precautions precautions on the use of multilayer ceramic capacitors www.datasheet.co.kr datasheet pdf - http://www..net/

▲Up To Search▲

Price & Availability of JMK316BJ106ML

	To Download JMK316BJ106ML Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .